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Ethiopia: Professor Receives Prestigious Award in Electronic Packaging
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The Daily Monitor (Addis Ababa)
28 March 2008
Posted to the web 28 March 2008
Addis Abeba
Ethiopian Professor Dereje Agonafer on Sunday received the Thermomechanical Challenges in Electronic Packaging-The Significant Contributor "THERMI" Award in electronic packaging, the awarding institution said on Wednesday.
Professor Dereje is director of Electronics, MEMS & Nanoelectronics Systems Packaging Center in Mechanical and Aerospace Engineering Department, University of Texas at Arlington. He is currently visiting Professor at MIT.
According to his resume posted on the Semi Conductor Thermal Measurement and Management Symposium website, Professor Agonafer received his PhD from Howard University and joined IBM. After 15 years at IBM, according to his resume published by the institute.
He joined the University of Texas at Arlington in 1999 as Professor and Director of Electronics, MEMS, and Nanoelectronics Systems Packaging Center.
He currently advises 16 graduate students including 6 PhDEs. Since joining UTA in 1999, he has graduated 53 graduate students.
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"As the Electronic Packaging industry develops technologies for fabrication of smaller, faster, economical and reliable products; thermal management and design play an important role," the website said on Wednesday.
Professor Agonafer has published over 100 conference and journal papers and eight issued patents.
In April 1998, Professor Agonafer was the recipient of the "The University of Colorado School of Engineering Distinguished Engineering Alumni Award (DEAA) in the category of Research and Invention." In November 1998, he received "The Howard University Distinguished PhD Alumni Award." Also, in November 1998, he received "ASME K-16/EEPD Clock Award for Outstanding Contribution in Computer Aided Thermal Management of Electronic Packages." In 2002, he received ASME International Electronic and Photonic Packaging Division Highest Division Award for "Outstanding Contributions to the Area of the Application of the Science and Engineering of Heat Transfer to Electronic and Photonic Packaging." .
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